NexGenHVEC

Advanced Materials, Technologies, and Prototypes for the Development of Cost-Effective Hybrid Varistor Electronic Components with Enhanced Thermal Stability

Program: Mobility – Systems and Components for Safety and Comfort: Active-Passive Structural Components
Project Duration: 01.07.2018 – 31.12.2021
Project Value:€2,608,941.00
Lead Partner: KEKO – VARICON d.o.o/Bourns d.o.o..

Other Consortium Partners: ELGOLINE d.o.o.; IRNAS – Institute for the Development of Advanced Applied Systems Rače; Faculty of Technologies and Systems

Description: The goal of the NexGenHVEC project was to enable the development and subsequent industrial production of advanced hybrid electronic protection systems with functional properties that significantly exceed the current state of the art, at lower production costs and in a more environmentally friendly manner, through the development of advanced materials, innovative methods, technologies, and prototypes.

Panel with Prototypes of the NexGenHVEC Printed Circuit Board