Our printed circuit boards (PCBs) offer advanced technologies such as HDI, VIPPO, and thermally conductive PCBs, with typologies ranging from single-sided to multi-layer boards (up to 18 layers). We use high-quality materials (FR4, PTFE, Rogers), ensure high precision (connections and insulation up to 75 µm), and comply with UL, ISO 9001, ISO 14001, and RICH/RoHS standards.
Printed circuit boards (PCBs) are the central element of modern electronics, enabling the connection and support of electronic components. Below are the key specifications of our printed circuit boards, ensuring top performance and reliability across various applications.
| Category | Description | Technical performance |
| Printed circuit boards (PCB) | Technologies | HDI/SBU pcb VIPPO/POFV Radio frequency ( RF ) pcb Back Plane pcb Thermally conductive pcb Power pcb Hybrid pcb Flex pcb Rigidflex pcb |
| PCB | Types | Single sided Double sided Multilayer Flex Teflon |
| Number of conductive and non-conductive layers | Maximum number of layers | Up to 26 layers |
| Working format | Maximum working format | 457mmx610mm |
| Final pcb thickness | Minimum and maximum | 0,050 mm – 3,2mm |
| Thickness of inner layers | Minimum and maximum | 0,050 mm – 3,2mm |
| Basic copper | External | 9µm, 12 μm, 18µm, 35µm, 50µm, 70µm, 105µm, 140µm, 210µm, 400µm |
| Internal | 18µm, 35µm, 50µm, 70µm, 105µm, 140µm, 210µm, 400µm | |
| Basic materials | FR4 Halogen free CEM1 CEM3 High frequency materials High TG/CTI materials Alu materials/CU based materials PTFE Rogers Polyimide | |
| Drilling diameter | 0,15 mm – 6,40 mm / larger holes are made by milling | |
| Blind vias | A/R | 01:01 |
| Burried vias | A/R | 01:01 |
| Metallization of holes | A/R | 01:10 |
| Copper pattern | Minimum bond width and insulation | 75 μm / 75µm |
| Tolerances | Etching: +/-20% Drilling: ± 0,050mm Milling: ± 0,10mm Scoring: +/-0,15mm Deep milling: +/-0,1mm Chamfering: +/-0,1mm Pressfit holes: ± 0,05mm | |
| Soldermask | Colours | Green: semi-matt, glossy Black: matt, extra matt White Blue Red Yellow Orange: FLEX |
| Silkprint | Colours | White Yellow Black Red Blue |
| Peelable mask | Colour | Blue Kapton |
| Plugged and filled vias | Via plugging with soldermask Epoxy filled | Type IV (a) Type VII |
| Carbon printing | yes | 40 Ohm +/- 5% |
| Surface protection | HAL lead free, HASL with Tin lead, Galvanic Sn, OSP, Hard gold, Immersion Sn, NiAu (ENIG), Immersion Ag, ENEPIG – outsorcing | |
| Special treatments | Technology | Edge plating Jump scoring Edge plating – half holes Pressfit with partially drilled hole (backdrill) Impedance controlled Coin technology Rigid – flex pcb |
| Quality | Electrical test AOI test Impedance control Dimensional control Microsection – analysis | Yes Yes Yes Yes Yes |
| Standards and certificates | UL certificate ISO 9001:2015 ISO 14001:2015 RICH and RoHS |
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