Technical Capabilities of PCB

Board Type:

  • Single -, Double sided, Flex, Teflon, Multilayer, High Freq, MetalCore,...

Nr. of conductive layers:

  • Up to 18

Laminate Materials:

  • FR4, Halogen free, CEM1, CEM3
  • High-freq materials
  • High Tg/CTI materials
  • Alu materials
  • PTFE, Rogers, Brass,Titanium, Polyimide, Stainless

Max board size in production:

  • 610 x 457 mm for ML
  • 1200 x 457 mm for SE and SD
  • 5000 x 340 mm for flex

Total board thickness:

  • 0,20 mm– 3,2 mm

Inner layer thickness:

  • 0,10 mm – 1,6 mm

Min line width, space:

  • 75 μm (25 μm)

Copper Foil Thickness on outer layers:

  • 12 μm – 105 μm, 210 μm, 400 μm

Copper Foil Thickness on inner layers:

  • 12 μm – 105 μm

Diameter of drilled holes:

  • 0,15 mm – 6,40 mm

Finished hole diameter:

  • 0,10 mm – 6,35 mm

Metallization Aspect Ratio:

  • 12 : 1

Blind Via Aspect Ratio:

  • 1 : 1

Solder resist:

  • Green matt and glossy, Black matt and glossy, White, Blue, Red, Yellow (Min. gap in finepitch 50 μm)

Legend Print:

  • White, Green, Yellow, Black, Red, Blue

Peelable Solder Mask:

  • Peters Blue

Via filler:

  • with solder resist

Carbon print:

  • 40 Ohm ± 5%

Surface Finishes:

  • HAL Lead Free
  • HAL Tin-Lead
  • Immersion NiAu (ENIG)
  • Immersion Ag
  • Immersion Tin
  • OSP
  • Hard gold

Tolerances:

  • Routing ± 0,10 mm
  • Scoring ± 0,10 mm
  • Etching ± 10%
  • Hole Tol. (Press fit) ± 0,05 mm

Quality Management:

  • UL conformance
  • Micro section
  • Automatic Optical Inspection
  • CCD
  • Electrical Testing