Surface Treatment

Chemical gold, Au: min. 0,05µm, Ni: min. 3,0µm

Galvanic gold, Au: min. 0,2µm

HAL SnPb

HAL Lead free

Chemical Sn

Chemical Nickel

OSP (Organic Surface Protection)

Chemical silver: 0,2 – 0,4µm

(Thickness and end treatment apply to circuit boards only)